Western Digital
Equipment Development Engineer, Laser Alignment & Photonic Packaging
Shenzhen, Guangdong Province, CN
Role snapshot
Western Digital is hiring a Equipment Development Engineer, Laser Alignment & Photonic Packaging on a full-time basis. This is a role based in Shenzhen, Guangdong Province, CN. The listing highlights Engineering and Computer Hardware.
- Company
- Western Digital
- Location
- Shenzhen, Guangdong Province, CN
- Job type
- Full-time
- Posted
- Oct 30, 2026
Who this role suits
The listing does not state a required experience level here. Read the requirements in the description below and apply if they match your background.
How to prepare your application
- Check your résumé against the listed skills (Engineering and Computer Hardware) and give each one a concrete example: what you built or achieved, not just that you used it.
- Match your résumé to the requirements in the description, using the same wording where it is honest to do so.
- Prepare a short example for each requirement you meet, and be ready to explain any you only partly meet.
- Read what Western Digital publishes about its product or team, so you can say clearly why this role and this company.
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About the role
Company Description
WD is building the infrastructure behind the AI-driven data economy.
As AI scales, so does data. Every interaction, every model, every system generates data that must be stored, managed, and made accessible over time. That’s where we come in.
We combine deep engineering expertise with global-scale manufacturing to deliver the storage systems that make AI possible, powering hyperscale data centers, cloud platforms, and enterprise infrastructure worldwide.
This isn’t theoretical work. It’s real systems, at real scale, people solving some of the hardest challenges in technology today.
We’re looking for people who want to build, solve, and operate at that level.
Join us and let’s shape the future of data.
Job Description
We are seeking a Senior Equipment Engineer to develop next-generation laser alignment, optical attachment, and packaging equipment for photonics applications.
Responsibilities
- Design and develop precision equipment, mechanisms, fixtures, and subsystems for laser alignment, optical attachment, photonic packaging, testing, and automation applications.
- Translate system and process requirements into robust equipment solutions with consideration for precision, reliability, manufacturability, and cost.
- Design precision positioning, alignment, motion control, and opto-mechanical systems to achieve high-performance assembly and packaging processes.
- Perform tolerance analysis, GD&T, and precision alignment studies to ensure system accuracy and repeatability.
- Develop 3D models, engineering drawings, BOMs, and technical documentation using SolidWorks.
- Lead prototype builds, system integration, debugging, verification, and performance optimization.
- Collaborate with optical, electrical, software, process, manufacturing, and quality teams to deliver complete equipment solutions.
- Support supplier engagement, NPI activities, equipment qualification, and manufacturing deployment.
Qualifications
Required
- Master's degree or above in Mechanical Engineering, Mechatronics, Opto-Mechanical Engineering, Automation, or related disciplines.
- Strong experience in precision mechanical and opto-mechanical system design.
- Hands-on experience developing semiconductor equipment, automation systems, assembly equipment, inspection systems, or other complex electro-mechanical systems.
- Solid understanding of precision alignment, tolerance analysis, GD&T, materials, and manufacturing processes.
- Proficiency in SolidWorks and engineering documentation.
- Experience in system integration, troubleshooting, root cause analysis, and engineering validation.
- Strong problem-solving skills and ability to work independently in a fast-paced environment.
- Excellent communication and teamwork skills.
Preferred
Experience in one or more of the following areas:
- Active Optical Alignment
- Laser Attach / Die Attach
- Optical Module Assembly
- Silicon Photonics (SiPh)
- Photonic Packaging
- Precision Motion Control & Nanopositioning
- Machine Vision & Optical Metrology
- Semiconductor Assembly Equipment
Additional Information
WD thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.
WD is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.
Notice To Candidates: Please be aware that WD and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to WD Ethics Helpline or email [email protected].